Download Applied materials science : applications of engineering by Deborah D. L. Chung PDF

By Deborah D. L. Chung

ISBN-10: 0849310733

ISBN-13: 9780849310737

Fabrics are the basis of know-how. As such, so much universities supply engineering undergraduates with the basic techniques of fabrics technology, together with crystal buildings, imperfections, part diagrams, fabrics processing, and fabrics houses. Few, even though, supply the sensible, applications-oriented history that their scholars have to achieve industry.

Applied fabrics technology: functions of Engineering fabrics in Structural, Electronics, Thermal, and different Industries fills that hole. From a cross-disciplinary point of view that displays either the multifunctionality of many fabrics and the vast scope business wishes, the writer examines the sensible functions of steel, ceramic, polymer, cement, carbon, and composite fabrics throughout a large diversity of industries. the subjects addressed comprise digital packaging, shrewdpermanent fabrics, thermal administration, nondestructive evaluate, and fabrics improvement. The textual content is apparent, coherent, and instructional well-liked, contains quite a few up to date references, and offers historical past fabric in a sequence of appendices.

Unique in its breadth of assurance of either fabrics and their functions, utilized fabrics technology is either scientifically wealthy and technologically suitable. if you happen to paintings or train those who aspire to paintings in an engineering skill, you can find no textual content or reference that larger prepares its readers for real-world functions of engineering fabrics.

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Additional info for Applied materials science : applications of engineering materials in structural, electronics, thermal, and other industries

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4. S. L. Chung, J. Mater. , 29, 3128-3150 (1994). 5. X. Yu, G. Zhang and R. Wu, J. Mater. , 6, 9-12 (June 1994). 6. E. W. Adams, Proc. 1995 Int. , Int. Electronics Packaging Society, pp. 220-227 (1995). 7. F. M. Xi, J. Mater. , 10(10), 2415-2417 (1995). 8. A. E. Hannon, 6th Int. , pp. 295-307 (1992). 9. -L. Shen, A. Needleman and S. Suresh, Met. Mater. , 5A(4), 839-850 (1994). 10. -L. Shen, Mater. Sci. Eng. A, 2, 269-275 (Sept. 1998). 11. J. L. Chung, J. Mater. , 28, 1435-1446 (1993). 12. J. L.

Xu, X. L. Chung, J. Electron. Packaging, 122(2), 128-131 (2000). Y. Xu, X. L. Chung, J. Electron. Packaging, in press. 4 Summary References SYNOPSIS Polymer-matrix composite materials for microelectronics are reviewed in terms of the science and applications. They include those with continuous and discontinuous fillers in the form of particles and fibers, as designed for high thermal conductivity, low thermal expansion, low dielectric constant, high/low electrical conductivity, and electromagnetic interference shielding.

Low density is desirable for both aerospace structures and aerospace electronics. Structural composites stress processability into large parts, such as panels, whereas electronic composites emphasize processability into small parts, such as stand-alone films and coatings. Because of the small size of the parts, material costs tend to be less of a concern for electronic composites than for structural composites. For example, electronic composites can use expensive fillers such as silver particles, which provide high electrical conductivity.

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